| Layer count |
12 |
32 |
| Layer to layer registration (+/- mils) |
5 |
3 |
| Minimum core thickness |
0.005" |
0.003" |
| Minimum finished PCB thickness |
0.020" |
0.012" |
| Maximum finished PCB thickness |
0.125" |
0.250" |
| Finishes |
|
|
| HASL (hot air solder level) / 63% Tin / 37% Lead |
Yes |
Yes |
| HASL (hot air solder level) / Lead free / SN100CL |
Yes |
Yes |
| Electroless Nickel - 100u" / Immersion Gold - 3" (ENIG) |
Yes |
Yes |
| Electroless Nickel - 100u" / Immersion Gold - 5" (ENIG) |
No |
Yes |
| Immersion Silver |
Yes |
Yes |
| Immersion Tin |
Yes |
Yes |
| OSP (Entek Cu106A) |
No |
Yes |
| Selective hard Gold plate up to 30u" |
No |
Yes |
| Carbon ink |
No |
Yes |
| VIP / non-conductive via fill |
No |
Yes |
| Conductive via fill (Tatsuta AE1244 - Copper paste) |
No |
Yes |
| Advanced / unique technologies in blue font |
No |
Yes |
| |
|
|
